苏州Microporous grinding and polishing machine
- Category:苏州Polishing equipment
- Release date:2021-08-03
- Description
- Product data download
■ Equipment introduction
This machine is specially developed for high-speed grinding and polishing of micro-holes below 0.5 mm. It adopts the liquid work mechanism to quickly polish the inner wall of the micro-hole, repair surface defects and improve the accuracy of the inner wall. As a new technology to replace the traditional abrasive flow process, it greatly improves the processing quality, improves the efficiency, and reduces the unit price of the processing cost.
■ Advantage
● The polishing efficiency is high, which is 5 times that of the traditional process.
● Using aqueous abrasive, low cost, easy to clean parts after polishing.
● Full-channel grinding and polishing can reach any corners that need to be polished.
● Polishing intensity and effect can be controlled and adjusted.
● The fixture is simple, convenient to install and easy to operate.
■ Technical parameter
■ Applicable processing parts
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微孔打磨抛光机
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